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认证现货(100)集成电路(IC)(11)二极管(1)三极管(2)场效应管MOSFET(1)电容器(1)石英晶体器件(1)连接器/接插件(3)
- 贴片/片式/SMD二极管(1)
- 开关三极管(2)
- MOSFET(1)
- 贴片(片式/SMD)电容(1)
- 贴片晶振(1)
- 条形(压接式)连接器(3)
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产品信息
板至板连接, 2.54 mm, 3 触点, 插座, BCS Series, 表面安装
封装参数
外形尺寸
物理参数
其他
TAIL SPECIFICATION
-SV: SINGLE VERTICAL (SEE FIG 1)
(USE SSM-XX-S)
-SH: SINGLE HORIZONTAL (SEE FIG 3, SHT 2)
(USE SSM-XX-SH)
-DH: DOUBLE HORIZONTAL (SEE FIG 4, SHT 3)
(USE BCH-XX-D)
PLATING SPECIFICATION
-S: 30μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-L: 10μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-T: MATTE TIN ON CONTACT AND TAIL.
-F: 3μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-STL: 30μ" SELECTIVE GOLD IN CONTACT
AREA, TIN/LEAD (90/10) ON TAIL.
-H: 30μ" SELECTIVE GOLD IN CONTACT
AREA, 3μ" SELECTIVE GOLD ON TAIL.
-LM: 10μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-TM: MATTE TIN ON CONTACT AND TAIL.
-FM: 3μ" SELECTIVE GOLD IN CONTACT
OPTION
-BE: BOTTOM ENTRY
(ONLY AVAILABLE ON -SV)
(USE SSM-XX-S-BE)
(SEE FIG 2, SHT 2)
OPTION
-P: PICK AND PLACE PAD
(ONLY AVAILABLE ON -SV,
USE PPP-12, SEE FIG 6, SHT 3)
(SEE NOTE 12)
-K: POLYIMIDE FILM PAD
(SEE FIG 5, SHT 2)
(USE K-DOT-.138-.250-.005)
(NOT AVAILABLE ON -SH AND -DH)
MOUNTING OPTION
-LC: LOCKING CLIP
(USE LC-05-TM, SEE NOTE 10)
(FOR -SH AND -DH USE MOLDED TO
POSITION BODIES)