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板至板连接, 2.54 mm, 3 触点, 插座, BCS Series, 表面安装
封装参数
外形尺寸
物理参数
其他
TAIL SPECIFICATION
-SV: SINGLE VERTICAL (SEE FIG 1)
(USE SSM-XX-S)
-SH: SINGLE HORIZONTAL (SEE FIG 3, SHT 2)
(USE SSM-XX-SH)
-DH: DOUBLE HORIZONTAL (SEE FIG 4, SHT 3)
(USE BCH-XX-D)
PLATING SPECIFICATION
-S: 30μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-L: 10μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-T: MATTE TIN ON CONTACT AND TAIL.
-F: 3μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-STL: 30μ" SELECTIVE GOLD IN CONTACT
AREA, TIN/LEAD (90/10) ON TAIL.
-H: 30μ" SELECTIVE GOLD IN CONTACT
AREA, 3μ" SELECTIVE GOLD ON TAIL.
-LM: 10μ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL.
-TM: MATTE TIN ON CONTACT AND TAIL.
-FM: 3μ" SELECTIVE GOLD IN CONTACT
OPTION
-BE: BOTTOM ENTRY
(ONLY AVAILABLE ON -SV)
(USE SSM-XX-S-BE)
(SEE FIG 2, SHT 2)
OPTION
-P: PICK AND PLACE PAD
(ONLY AVAILABLE ON -SV,
USE PPP-12, SEE FIG 6, SHT 3)
(SEE NOTE 12)
-K: POLYIMIDE FILM PAD
(SEE FIG 5, SHT 2)
(USE K-DOT-.138-.250-.005)
(NOT AVAILABLE ON -SH AND -DH)
MOUNTING OPTION
-LC: LOCKING CLIP
(USE LC-05-TM, SEE NOTE 10)
(FOR -SH AND -DH USE MOLDED TO
POSITION BODIES)